Enhanced double patterning decomposition using lines encoding
نویسندگان
چکیده
منابع مشابه
Revisiting the Layout Decomposition Problem for Double Patterning Lithography
In double patterning lithography (DPL) layout decomposition for 45nm and below process nodes, two features must be assigned opposite colors (corresponding to different exposures) if their spacing is less than the minimum coloring spacing. 11, 14 However, there exist pattern configurations for which pattern features separated by less than the minimum coloring spacing cannot be assigned different...
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Triple patterning lithography (TPL) is one of the most promising techniques in the 14-nm logic node and beyond. Conventional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently, as an alternative process, TPL with end-cutting (LELE-EC) was proposed to overcome the limitations of LELELE manufacturing. In the LELE-EC process, the first two masks are LELE typ...
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Triple patterning lithography (TPL) is one of the most promising techniques in the 14nm logic node and beyond. However, traditional LELELE type TPL technology suffers from native conflict and overlapping problems. Recently LELEEC process was proposed to overcome the limitations, where the third mask is used to generate the end-cuts. In this paper we propose the first study for LELEEC layout dec...
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ژورنال
عنوان ژورنال: Journal of Electrical Systems and Information Technology
سال: 2016
ISSN: 2314-7172
DOI: 10.1016/j.jesit.2015.08.004